DOCBOND|Low Temperature Curing Adhesive

Name: DOCBOND|Low Temperature Curing Adhesive
Brand: Low Temperature Curing Adhesive
Price: Negotiable

FOB Price

Negotiable / Bag

50 Bags(Min.Order)

Supply Ability 1000 Bag / Bags per Month
Port Qingdao
Delivery Detail:7 days

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Product Details

Brand Name:	Low Temperature Curing Adhesive	Place of Origin:	China	Model Number:	DB291
Classification:	Hot Melt Adhesives	Usage:	Other, High temperature waterproof seal	Main Raw Material:	Acrylic

Product Description

DB291

This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.

Contact Us

QINGDAO DOCBOND NEW MATERIAL CO.LTD: Contact nameKang Cheng; Phone86-0532-81700039; Address628 Jiushui East Road，Laoshan District Qingdao,Shandong